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July 18, 2008
Power Integrations Announces New Package for its TOPSwitch-HX Products of ICs
Power Integrations (News - Alert), a specialist in the field of integrated-circuit technology for the power conversion market through their series of high-voltage analog integrated circuits (ICs), has just launched another new, ultra-low-profile eSIP-L package style for its popular TOPSwitch-HX family of AC-DC power conversion ICs.
The company also revealed that the TOP260LN, TOP261LN and TOP262LN devices suitable for slim adapters from 20 W to 100 W power levels are available in the new eSIP-L package style for $1.00 each in 10K unit quantities with immediate effect.
The TOPSwitch line of products introduced by Power Integrations in 1994 was the first IC to cost-effectively integrate a 700 voltage power MOSFET (metal–oxide–semiconductor field-effect transistor); high voltage switched current source, PWM control, oscillator, thermal shutdown circuit, fault protection and other control circuitry onto a monolithic device.
“The eSIP-L package delivers the same thermal performance as the older TO-220 package but with a much lower profile,” said Andrew Smith, product manager at Power Integrations.
The new package combines great efficiency and high operating frequency of TOPSwitch-HX and enables remarkably slim, compact, and lightweight power supplies from 20 to 100 watts. Applications include adapters for notebook computers, as well as power supplies for LCD monitors and flat-panel TVs, in which slim form factor and high efficiency have become critical design criteria.
The new "L" shaped lead-bend enables extremely slender power supply designs. The package's 90 degree pin deflection enables the PCB, chip and heatsink to lie parallel to each other, while the high switching frequency of TOPSwitch-HX eliminates the need for an expensive planar type transformer. This, along with the transformer design, greatly contributes to reduced cost and size of the notebook adapter.
Smith said, “The combination of TOPSwitch-HX with the new low-profile lead-bend package makes it possible to build slimline adapters - just 15mm thick - using standard wire-wound transformers and simple manufacturing techniques at a cost similar to a standard laptop adapter brick."
Jai C.S. is a contributing editor for TMCnet. To read more of Jai’s articles, please visit his columnist page.
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